Patent Assignment
Reel/Frame 059044/0677
Assignment of Assignor's Interest
Recorded: 2022-02-18
Pages: 4
Assignee
SHOWA DENKO MATERIALS CO., LTD.
9-2, MARUNOUCHI 1-CHOME, CHIYODA-KU, TOKYO, 100-6606, JAPAN
Covered Property
(1)
Photosensitive Resin Composition, Photosensitive Resin Film, Multilayer Printed Wiring Board, Semiconductor Package, and Production Method for Multilayer Printed Wiring Board
Application:
17/634,927 →
Publication:
US 2022/0276558
Related Assignments
(2)
Other recorded transfers of the patent in this record — the chain of ownership.