Patent Assignment
Reel/Frame 059046/0712
Assignment of Assignor's Interest
Recorded: 2022-02-18
Pages: 7
Assignors
YOO, INPIL
Executed: 2019-10-10
IM, SEUNGWON
Executed: 2019-10-10
EOM, JOOYANG
Executed: 2019-10-11
TEYSSEYRE, JEROME
Executed: 2019-10-10
Assignee
SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
5005 E. MCDOWELL ROAD, MD A700, PHOENIX, ARIZONA, 85008
Covered Property
(1)
Clips for Semiconductor Package and Related Methods
Application:
17/651,621 →
Publication:
US 2022/0173022
Related Assignments
(3)
Other recorded transfers of the patent in this record — the chain of ownership.
Security Interest
May 3, 2022
From: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
To: DEUTSCHE BANK AG NEW YORK BRANCH, AS COLLATERAL AGENT
Reel/Frame 059847/0433 →
Security Interest
Jul 13, 2023
From: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC; GTAT CORPORATION
To: JPMORGAN CHASE BANK, N.A.
Reel/Frame 064271/0971 →
Release of Security Interest in Patents Recorded at Reel 059847, Frame 0433
Nov 9, 2023
From: DEUTSCHE BANK AG NEW YORK BRANCH, AS COLLATERAL AGENT
To: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
Reel/Frame 065525/0001 →