Patent Assignment
Reel/Frame 059066/0113
Assignment of Assignor's Interest
Recorded: 2022-02-22
Pages: 4
Assignors
TAI, AN-HUNG
Executed: 2022-02-16
CHEN, JIAN-HAO
Executed: 2022-02-17
CHEN, HUI-CHI
Executed: 2022-02-16
YU, KUO-FENG
Executed: 2022-02-17
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
NO. 8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK, HSINCHU, 300-78, TAIWAN
Covered Property
(1)
Semiconductor Device Structure and Method for Forming the Same