Patent Assignment
Reel/Frame 059068/0897
Assignment of Assignor's Interest
Recorded: 2022-02-22
Pages: 4
Assignors
PENG, CHI-CHUN
Executed: 2022-02-06
CHIU, CHIH-YUAN
Executed: 2022-02-06
WU, MIN-YU
Executed: 2022-02-15
TU, YI-KAI
Executed: 2022-02-15
WU, CHENG-LUNG
Executed: 2022-01-27
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
8, LI-HSIN ROAD 6, HSINCHU SCIENCE PARK, HSINCHU, 30078, TAIWAN
Covered Property
(1)
Semiconductor Die Dipping Structure