Patent Assignment
Reel/Frame 059071/0317
Assignment of Assignor's Interest
Recorded: 2022-02-23
Pages: 4
Assignors
TSAI, TSUNG-FU
Executed: 2022-02-23
WANG, PU
Executed: 2022-02-15
SHIH, YING-CHING
Executed: 2022-02-15
LU, SZU-WEI
Executed: 2022-02-15
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LIMITED
NO. 8, LI-HSIN 6 ROAD, HSINCHU SCIENCE PARK, HSINCHU, ROC 30077, TAIWAN
Covered Property
(1)
Package Assembly Including a Package Lid Having an Inner Foot and Methods of Making the Same