Package assembly including a package lid having an inner foot and methods of making the same
A package assembly may include a package substrate, a package lid attached to the package substrate and including a plate portion, an outer foot extending from the plate portion, and an inner foot extending from the plate portion inside the outer foot, and an adhesive that adheres the outer foot to the package substrate and the inner foot to the package substrate.
1. A package assembly comprising:
a package substrate;
a package lid attached to the package substrate, comprising:
a plate portion;
an outer foot extending from the plate portion; and
an inner foot extending from the plate portion inside the outer foot; and
an adhesive that adheres the outer foot to the package substrate and the inner foot to the package substrate, wherein the adhesive has a first thickness at the outer foot and a second thickness at the inner foot, and the second thickness is greater than the first thickness.
2. The package assembly of claim 1 , wherein the outer foot extends from the plate portion by a first distance, and the inner foot extends from the plate portion by a second distance, wherein the second distance is less than the first distance.
3. The package assembly of claim 1 , wherein a difference between the first thickness and the second thickness is in a range of 50 μm to 300 μm.
4. The package assembly of claim 2 , wherein the inner foot comprises a first inner foot portion that extends from the plate portion by the second distance, and a second inner foot portion that extends from the plate portion by a third distance, wherein the third distance is less than the second distance.
5. The package assembly of claim 4 , wherein the adhesive has a first thickness at the outer foot, a second thickness at the first inner foot portion, and a third thickness at the second inner foot portion, and
wherein the second thickness is greater than the first thickness and the third thickness is greater than the second thickness.
6. The package assembly of claim 1 , wherein the adhesive comprises:
a first adhesive that adheres the outer foot to the package substrate; and
a second adhesive that is different than the first adhesive and adheres the inner foot to the package substrate.
7. The package assembly of claim 6 , wherein the first adhesive has a first elastic modulus and the second adhesive has a second elastic modulus, wherein the second elastic modulus is less than the first elastic modulus.
8. The package assembly of claim 1 , wherein the inner foot has a width that is greater than or equal to a width of the outer foot.
9. The package assembly of claim 1 , wherein the inner foot is one of joined to the outer foot or separated from the outer foot.
10. The package assembly of claim 1 , further comprising:
an interposer module on the package substrate and between the package lid and the package substrate; and
a thermal interface material (TIM) film between the interposer module and the package lid.
11. The package assembly of claim 10 , wherein the inner foot is located between the outer foot and the interposer module.
12. The package assembly of claim 1 , further comprising:
a plurality of semiconductor devices mounted on the package substrate and between the package lid and the package substrate; and
a thermal interface material (TIM) film between the plurality of semiconductor devices and the package lid.
13. The package assembly of claim 12 , wherein the inner foot comprises an interior inner foot located between the plurality of semiconductor devices and comprises one of a sight-shaped inner foot, cross-shaped inner foot and column-shaped inner foot, and
wherein the outer foot extends from the plate portion by a first distance, and the interior inner foot extends from the plate portion by a second distance equal to or greater than the first distance.
14. The package assembly of claim 12 , wherein the TIM film comprises a gel TIM including a cross-linking catalyst in a range from 2 ppm to 4 ppm.
15. A method of making a package assembly, the method comprising:
forming an adhesive on a package substrate;
disposing a package lid on the adhesive, the package lid comprising a plate portion, an outer foot extending from the plate portion, and an inner foot extending from the plate portion inside the outer foot; and
pressing the package lid onto the package substrate and curing the adhesive so that the adhesive adheres the outer foot to the package substrate and the inner foot to the package substrate, wherein the pressing of the package lid onto the package substrate comprises:
pressing the outer foot onto the adhesive so that the adhesive has a first thickness at the outer foot; and
pressing the inner foot onto the adhesive so that the adhesive has a second thickness at the inner foot, and the second thickness is greater than the first thickness.
16. The method of claim 15 , further comprising:
mounting an interposer module on the package substrate; and
disposing a thermal interface material (TIM) film on the interposer module,
wherein the disposing of the package lid on the adhesive comprises locating the inner foot between the outer foot and the interposer module.
17. The method of claim 15 , further comprising:
mounting a plurality of semiconductor devices on the package substrate; and
disposing a thermal interface material (TIM) film on the plurality of semiconductor devices,
wherein the disposing of the package lid on the adhesive comprises locating the inner foot between the plurality of semiconductor devices.
18. A package assembly comprising:
a package substrate;
a package lid mounted on the package substrate and attached to the package substrate by a first adhesive;
a plurality of semiconductor devices mounted on the package substrate between the package lid and the package substrate; and
a dummy die mounted on the package substrate between the package lid and the package substrate, wherein the dummy die is attached to the package substrate between the plurality of semiconductor devices and the package lid is attached to the dummy die by a second adhesive.
19. The package assembly of claim 18 , wherein the package lid is attached to an upper surface of the package substrate by the first adhesive and the dummy die is attached to the upper surface of the package substrate by an adhesive.
20. The package assembly of claim 18 , wherein the package lid comprises an outer foot attached to the package substrate and a semiconductor device of the plurality of semiconductor devices is located between the dummy die and the outer foot of the package lid.