IP Library › Granted Patent US 9,478,476

Granted Patent B2

US 9,478,476 · App. 13/976,098 · Granted Oct 25, 2016

Package for a microelectronic die, microelectronic assembly containing same, microelectronic system, and method of reducing die stress in a microelectronic package

Inventors: Debendra Mallik (Chandler, AZ); Sridhar Narasimhan (Chandler, AZ); Mathew J. Manusharow (Phoenix, AZ); Thomas A. Boyd (North Plains, OR)

Assignee: Intel Corporation

H01L23/34 H01L21/50 H01L23/36 H01L23/3675 H01L23/42 H01L23/49833 H01L25/0655 H01L2224/16225 H01L2224/73253 H01L2924/01327

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Quick Facts

Patent No.: US 9,478,476
App. No.: 13/976,098
Granted: Oct 25, 2016
Kind: B2

External Links

USPTO Patent Center↗ Full Patent PDF↗

Abstract

A package for a microelectronic die ( 110 ) includes a first substrate ( 120 ) adjacent to a first surface ( 112 ) of the die, a second substrate ( 130 ) adjacent to the first substrate, and a heat spreader ( 140 ) adjacent to a second surface ( 111 ) of the die. The heat spreader makes contact with both the first substrate and the second substrate.

Claims (92)

1. A package for a microelectronic die, the package comprising:

a first substrate adjacent to a first surface of the die;

a second substrate adjacent to the first substrate; and

a heat spreader adjacent to a second surface of the die, wherein the heat spreader makes contact with both the first substrate and the second substrate, wherein:

the first surface of the first substrate comprises a first side, a second side opposite the first side, a third side extending between the first side and the second side, and a fourth side opposite the third side;

the second substrate comprises a first surface and an opposing second surface, where the first surface of the second substrate is adjacent to the second surface of the first substrate;

the first surface of the second substrate comprises a fifth side, a sixth side opposite the fifth side, a seventh side extending between the fifth side and the sixth side, and an eighth side opposite the seventh side; and

the heat spreader makes contact with the first substrate at two or more of the first side, the second side, the third side, and the fourth side, and makes contact with the second substrate only at the fifth side and the sixth side and not at the seventh side and the eighth side.

2. The package of claim 1 wherein:

the first surface of the die defines a first plane;

the heat spreader makes contact with the first substrate at a first substrate contact area and makes contact with the second substrate at a second substrate contact area; and

the first substrate contact area is located in the first plane and the second substrate contact area is located in a second plane that is parallel to the first plane.

3. The package of claim 1 wherein:

the first substrate comprises a first surface and an opposing second surface, where the first surface of the first substrate is adjacent to the first surface of the die and the second surface of the first substrate is adjacent to the second substrate;

the first substrate comprises a first plurality of interconnects having a first pitch at the first surface of the first substrate and a second plurality of interconnects having a second pitch at the second surface of the first substrate; and

the first pitch is smaller than the second pitch.

4. The package of claim 1 wherein:

the second substrate comprises a first surface and an opposing second surface, where the first surface of the second substrate is adjacent to the second surface of the first substrate;

the heat spreader makes contact with the first substrate only at the first side and the second side and not at the third side and the fourth side, and makes contact with the second substrate at two or more of the fifth side, the sixth side, the seventh side, and the eighth side.

5. The package of claim 1 wherein:

the heat spreader makes contact with the second substrate at a second substrate contact area located at an edge of the heat spreader; and

the edge of the heat spreader contains a step located above the second substrate contact area.

6. The package of claim 5 wherein:

the heat spreader makes contact with the first substrate at a first substrate contact area located at the edge of the heat spreader; and

the edge of the heat spreader contains a second step located above the first substrate contact area.

7. The package of claim 5 , wherein:

the contact surface is co-planar with the first surface of the die.

8. The package of claim 1 wherein:

the heat spreader comprises a first piece and a second piece;

the first piece comprises a cap;

the second piece comprises a base that makes contact with the first substrate at a first substrate contact area and makes contact with the second substrate at a second substrate contact area; and

the second piece contains a step located above the second substrate contact area.

9. A microelectronic assembly comprising:

an integrated circuit package;

a socket compatible with the integrated circuit package; and

an independent loading mechanism,

wherein:

the integrated circuit package comprises:

a die;

a first substrate;

a second substrate; and

a heat spreader that makes contact with both the first substrate and the second substrate;

the heat spreader comprises a step providing a contact surface; and

the independent loading mechanism makes contact with the heat spreader at the contact surface.

10. The microelectronic assembly of claim 9 wherein:

the first substrate comprises a first surface and an opposing second surface, where the first surface of the first substrate is adjacent to a first surface of the die and the second surface of the first substrate is adjacent to the second substrate;

the first pitch is smaller than the second pitch.

11. The microelectronic assembly of claim 9 wherein:

the second substrate comprises a first surface and an opposing second surface, where the first surface of the second substrate is adjacent to the second surface of the first substrate;

12. The microelectronic assembly of claim 9 wherein:

the second substrate comprises a first surface and an opposing second surface, where the first surface of the second substrate is adjacent to the second surface of the first substrate;

13. The microelectronic assembly of claim 9 wherein:

the heat spreader comprises a first piece and a second piece;

the first piece comprises a cap;

the second piece comprises a base that makes contact with the first substrate at a first substrate contact area and makes contact with the second substrate at a second substrate contact area; and

the step providing the contact surface is located above the second substrate contact area.

14. The microelectronic assembly of claim 9 further comprising:

a system board into which the socket is integrated.

15. A method of reducing die stress in a microelectronic package, the method comprising:

mounting a die on a first substrate;

mounting the first substrate on a second substrate that has a footprint larger than the first substrate;

providing a heat spreader that has a top side and a bottom side, wherein the bottom side has a first substrate contact area and a second substrate contact area; and

mounting the heat spreader on the first substrate and the second substrate such that the first substrate contact area makes contact with the first substrate and the second substrate contact area makes contact with the second substrate, wherein:

a first surface of the die defines a first plane;

the first substrate contact area is located in the first plane and the second substrate contact area is located in a second plane that is parallel to the first plane;

the heat spreader contains a step providing a contact surface located in the first plane above the second substrate contact area; and

the method further comprises causing an independent loading mechanism to contact the heat spreader at the contact surface.

16. A method of reducing die stress in a microelectronic package, the method comprising:

mounting a die on a first substrate;

mounting the first substrate on a second substrate that has a footprint larger than the first substrate;

providing a heat spreader that has a top side and a bottom side, wherein the bottom side has a first substrate contact area and a second substrate contact area; and

a first surface of the first substrate comprises a first side, a second side opposite the first side, a third side extending between the first side and the second side, and a fourth side opposite the third side;

a first surface of the second substrate comprises a fifth side, a sixth side opposite the fifth side, a seventh side extending between the fifth side and the sixth side, and an eighth side opposite the seventh side; and

mounting the heat spreader further comprises mounting the heat spreader such that the first substrate contact area makes contact with the first substrate at two or more of the first side, the second side, the third side, and the fourth side and such that the second substrate contact area makes contact with the second substrate only at the fifth side and the sixth side and not at the seventh side and the eighth side.

17. A package for a microelectronic die, the package comprising:

a first substrate adjacent to a first surface of the die;

a second substrate adjacent to the first substrate; and

a heat spreader adjacent to a second surface of the die, wherein the heat spreader makes contact with both the first substrate and the second substrate, wherein:

the second substrate comprises a first surface and an opposing second surface, where the first surface of the second substrate is adjacent to the second surface of the first substrate;

Assignments (1)

ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Sep 18, 2026

From: INTEL CORPORATION

To: INTEL FOUNDRY IP LLC

Reel/Frame 076065/0923 →

Continuity (1)

Related Publication 20130270691A1 · Oct 17, 2013