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Patent Assignment
Reel/Frame 059074/0593

Assignment of Assignor's Interest

Recorded: 2022-02-23 Pages: 3
Assignor
SU, KUO-HUI
Executed: 2020-10-08
Assignee
NANYA TECHNOLOGY CORPORATION
NO.98, NANLIN RD., TAISHAN DIST., NEW TAIPEI CITY, 243, TAIWAN
Covered Property (1)
Method for Preparing Semiconductor Device Structure with Manganese-Containing Linling Layer
Application: 17/678,223 →
Publication: US 2022/0173041