Patent Assignment
Reel/Frame 059084/0055
Assignment of Assignor's Interest
Recorded: 2022-02-24
Pages: 4
Assignors
TERAO, HOSHIAKI
Executed: 2022-01-17
HASHIMOTO, KOUICHI
Executed: 2022-01-17
WADA, RAITA
Executed: 2022-01-17
Assignees
JFE PRECISION CORPORATION
2-3, KAMIOSE-CHO, HIGASHI-KU,, NIIGATA-SHI, NIIGATA, 9500063, JAPAN
JFE STEEL CORPORATION
2-3, UCHISAIWAI-CHO 2-CHOME,, CHIYODA-KU, TOKYO, 1000011, JAPAN
Covered Property
(1)
Heat Sink, Semiconductor Package and Semiconductor Module