IP Library › Assignment 059107/0070
Patent Assignment
Reel/Frame 059107/0070

Assignment of Assignor's Interest

Recorded: 2022-02-25 Pages: 5
Assignors
CHIN, SHU-CHENG
Executed: 2022-02-22
GAO, MING-YUAN
Executed: 2022-02-22
CHANG, CHUN-KAI
Executed: 2022-02-22
NIU, CHEN-YI
Executed: 2022-02-24
PENG, HSIN-YING
Executed: 2022-02-23
LIN, CHI-FENG
Executed: 2022-02-22
SU, HUNG-WEN
Executed: 2022-02-24
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LIMITED
8, LI-HSIN RD., 6 HSINCHU SCIENCE PARK, HSINCHU, 300-78, TAIWAN
Covered Property (1)
Conductive Structures with Bottom-Less Barriers and Liners
Application: 17/652,593 →
Publication: US 2023/0029867
Related Assignments (1)
Other recorded transfers of the patent in this record — the chain of ownership.
Corrective Assignment to Correct the the Assignee Previously Recorded at Reel: 059107 Frame: 007. Assignor(S) Hereby Confirms the Assignment. Mar 17, 2023
From: CHIN, SHU-CHENG; GAO, MING-YUAN; CHANG, CHUN-KAI; NIU, CHEN-YI
To: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
Reel/Frame 063115/0270 →