Patent Assignment
Reel/Frame 059121/0176
Assignment of Assignor's Interest
Recorded: 2022-02-28
Pages: 5
Assignors
HAN, JI HYE
Executed: 2022-01-26
KIM, JUNG MIN
Executed: 2022-01-26
KANG, BYUNG WOO
Executed: 2022-01-26
CHOI, HONG JE
Executed: 2022-01-26
PARK, HYE JIN
Executed: 2022-01-26
LEE, SANG WOOK
Executed: 2022-01-26
KOO, BON SEOK
Executed: 2022-01-27
LEE, JUNG WON
Executed: 2022-01-26
Assignee
SAMSUNG ELECTRO-MECHANICS CO., LTD.
MAEYOUNG-RO 150 (MAETAN-DONG), YOUNGTONG-GU, SUWON-SI, GYEONGGI-DO, KOREA, REPUBLIC OF
Covered Property
(1)
MULTILAYER ELECTRONIC COMPONENT with conductive resin layer