Patent Assignment
Reel/Frame 059122/0799
Assignment of Assignor's Interest
Recorded: 2022-02-28
Pages: 4
Assignor
OKUDA, SHINYA
Executed: 2022-02-18
Assignee
KIOXIA CORPORATION
1-21, SHIBAURA 3-CHOME, MINATO-KU, TOKYO, JAPAN
Covered Property
(1)
Semiconductor Device and Method of Manufacturing the Same