Patent Assignment
Reel/Frame 059123/0515
Assignment of Assignor's Interest
Recorded: 2022-02-28
Pages: 9
Assignors
ELSHERBINI, ADEL A.
Executed: 2021-10-26
VAN DOREN, STEPHEN R.
Executed: 2021-12-20
GUPTA, RITU
Executed: 2021-10-29
PASDAST, GERALD S.
Executed: 2021-11-30
MUNOZ, ROBERT J.
Executed: 2021-10-31
LIFF, SHAWNA M.
Executed: 2021-11-24
Assignee
INTEL CORPORATION
2200 MISSION COLLEGE BOULEVARD, SANTA CLARA, CALIFORNIA, 95054
Covered Property
(1)
Packaging Architecture for Modular Die Interoperability
Application:
17/557,622 →
Publication:
US 2023/0197677