IP Library Assignment 059131/0168
Patent Assignment
Reel/Frame 059131/0168

Assignment of Assignor's Interest

Recorded: 2022-03-01 Pages: 4
Assignor
TDK ELECTRONICS AG
Executed: 2022-01-26
Assignee
TDK CORPORATION
2-5-1, NIHONBASHI, CHUO-KU, TOKYO, 103- 6128, JAPAN
Covered Property (1)
Microelectromechanical Microphone Having a Robust Backplate
Application: 17/225,581 →
Publication: US 2021/0331914
Related Assignments (2)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest Apr 8, 2021
From: LEIDL, ANTON; ROMBACH, PIRMIN
To: TDK ELECTRONICS AG
Reel/Frame 055867/0076 →
Assignment of Assignor's Interest Oct 13, 2025
From: TDK CORPORATION
To: INVENSENSE, INC.
Reel/Frame 073080/0824 →