Patent Assignment
Reel/Frame 059164/0669
Assignment of Assignor's Interest
Recorded: 2022-03-03
Pages: 4
Assignors
UZOH, CYPRIAN EMEKA
Executed: 2022-02-25
FOUNTAIN, GAIUS GILLMAN, JR.
Executed: 2022-02-25
HUDSON, GEORGE CARLTON
Executed: 2022-02-25
POSTHILL, JOHN
Executed: 2022-03-01
Assignee
INVENSAS BONDING TECHNOLOGIES, INC.
3025 ORCHARD PARKWAY, SAN JOSE, CALIFORNIA, 95134
Covered Property
(1)
Structures with Through-Substrate Vias and Methods for Forming the Same
Related Assignments
(2)
Other recorded transfers of the patent in this record — the chain of ownership.
Security Interest
May 19, 2023
From: ADEIA GUIDES INC.; ADEIA MEDIA HOLDINGS LLC; ADEIA MEDIA SOLUTIONS INC.; ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
To: BANK OF AMERICA, N.A., AS COLLATERAL AGENT
Reel/Frame 063707/0884 →
Change of Name
Dec 28, 2023
From: INVENSAS BONDING TECHNOLOGIES, INC.
To: ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
Reel/Frame 066156/0478 →