Structures with through-substrate vias and methods for forming the same
A microelectronic structure with through substrate vias (TSVs) and method for forming the same is disclosed. The microelectronic structure can include a bulk semiconductor with a via structure. The via structure can have a first and second conductive portion. The via structure can also have a barrier layer between the first conductive portion and the bulk semiconductor. The structure can have a second barrier layer between the first and second conductive portions. The second conductive portion can extend from the second barrier layer to the upper surface of the bulk semiconductor. The microelectronic structure containing TSVs is configured so that the microelectronic structure can be bonded to a second element or structure.
1. A microelectronic structure comprising:
a back side and a front side opposite the back side;
a bulk semiconductor portion having a back surface and a front surface opposite the back surface, wherein the front surface comprises an active surface including active integrated circuitry formed in or on the front surface; and
a via structure disposed in an opening extending at least partially through the bulk semiconductor portion through the back surface along a direction non-parallel to the back surface, the via structure comprising a first conductive via portion, a second conductive via portion, a first barrier layer extending along a sidewall of the first conductive via portion, and a second barrier layer the second barrier layer including a first portion disposed between the first conductive via portion and the second conductive via portion, the second conductive via portion overlying the first conductive via portion and extending from the second barrier layer to at least the back surface,
wherein an end of the second conductive via portion defines a portion of the back side of the microelectronic structure, and
wherein the end of the second conductive via portion serves as a contact pad configured for direct bonding to a corresponding conductive feature of another element.
2. The microelectronic device of claim 1 , further comprising a dielectric layer on the back surface of the bulk semiconductor portion, the second conductive via portion extending through the dielectric layer such that the end of the second conductive via portion is flush with or recessed from an upper surface of the dielectric layer.
3. The microelectronic device of claim 2 , wherein the dielectric layer comprises a planarized dielectric bonding layer configured for direct bonding to another element.
4. The microelectronic device of claim 3 , wherein the dielectric layer further comprises a dielectric barrier layer on the bulk semiconductor portion, the planarized dielectric bonding layer disposed on the dielectric barrier layer.
5. The microelectronic device of claim 1 , wherein the second barrier layer includes a second portion extending along the first barrier layer between the first barrier layer and the second conductive via portion.
6. The microelectronic device of claim 1 , wherein a first metal texture of the first conductive via portion is different from a second metal texture of the second conductive via portion.
7. The microelectronic device of claim 6 , wherein the second metal texture has grains oriented along a 111 crystal plane non-parallel to a bond interface.
8. The microelectronic device of claim 1 , wherein the first and second conductive via portions comprises copper, the copper of the first conductive via portion having an impurity material therein.
9. The microelectronic device of claim 8 , wherein the first conductive via portion has a higher impurity concentration than the second conductive via portion.
10. The microelectronic device of claim 8 , wherein the first conductive via portion further comprises one or more alloying elements including one or more of beryllium (Be), indium (In), gallium (Ga), manganese (Mn), and nickel (Ni).
11. The microelectronic device of claim 8 , wherein the impurity material comprises one or more of sulfur, oxygen, carbon, or nitrogen.
12. The microelectronic device of claim 1 , wherein the first and second conductive via portions comprise different metals or different alloys.
13. A bonded structure comprising the microelectronic device of claim 1 , wherein the microelectronic device is directly bonded to another element without an intervening adhesive.
14. The bonded structure of claim 13 , wherein nonconductive bonding regions of the microelectronic element and the another element are directly bonded without an intervening adhesive.
15. A microelectronic structure comprising:
a back side and a front side opposite the back side;
a bulk semiconductor portion having a back surface and a front surface opposite the back surface, wherein the front surface comprises an active surface having active circuitry formed therein or thereon; and
a via structure disposed in an opening extending at least partially through the bulk semiconductor portion through the back surface along a direction non-parallel to the back surface, the via structure comprising a first conductive via portion and a second conductive via portion disposed directly onto and contacting the first conductive via portion without an intervening barrier layer, the second conductive via portion disposed between the back surface and the first conductive via portion and overlying the first conductive via portion, the first conductive via portion having a different material composition from the second conductive via portion,
wherein an end of the second conductive via portion defines a portion of the back side of the microelectronic structure, and
wherein the end of the second conductive via portion serves as a contact pad configured for direct bonding to a corresponding conductive feature of another element.
16. The microelectronic device of claim 15 , further comprising a barrier layer extending along a sidewall of the first and second conductive portions.
17. The microelectronic device of claim 15 , further comprising a dielectric layer on the back surface of the bulk semiconductor portion, the dielectric layer defining another portion of the back side of the microelectronic structure, the second conductive via portion extending through the dielectric layer such that the end of the second conductive via portion is flush with or recessed below an upper surface of the dielectric layer.
18. The microelectronic device of claim 15 , wherein the first and second conductive via portions comprises copper, the copper of the first conductive via portion having an impurity material therein.
19. The microelectronic device of claim 18 , wherein the first conductive via portion comprises one or more alloying elements including one or more of beryllium (Be), indium (In), gallium (Ga), manganese (Mn), and nickel (Ni).
20. The microelectronic device of claim 18 , wherein the impurity material comprises one or more of sulfur, oxygen, carbon, or nitrogen.
21. The microelectronic device of claim 15 , wherein the first and second conductive via portions comprise different metals or different alloys.
22. A bonded structure comprising the microelectronic device of claim 15 , wherein the back side of the microelectronic device is directly bonded to another element without an intervening adhesive.
23. A microelectronic structure comprising:
a bulk semiconductor portion having a back surface and a front surface opposite the back surface, wherein the front surface comprises an active surface having active circuitry formed therein or thereon; and
a via structure disposed in an opening extending at least partially through the bulk semiconductor portion through the back surface along a direction non-parallel to the back surface, the via structure comprising a first conductive via portion and a second conductive via portion disposed directly onto and contacting the first conductive via portion without an intervening barrier layer, the second conductive via portion disposed between the back surface and the first conductive via portion and overlying the first conductive via portion, the first conductive via portion being formed before, and separately from, the second conductive via portion,
wherein an end surface of the second conductive via portion defines a portion of a back side of the microelectronic structure and serves as a contact pad configured for direct bonding to a corresponding conductive feature of another element.
24. The microelectronic device of claim 23 , further comprising a barrier layer extending along a sidewall of the first and second conductive portions.
25. The microelectronic device of claim 23 , wherein a first metal texture of the first conductive via portion is different from a second metal texture of the second conductive via portion.
26. The microelectronic device of claim 25 , wherein the second metal texture has grains oriented along a 111 crystal plane.
27. The microelectronic device of claim 26 , wherein the first metal texture has a first proportion of 111 planes oriented within 30° of vertical, wherein the second metal texture has a second proportion of 111 planes oriented within 30° of vertical, the second proportion greater than the first portion.
28. The microelectronic device of claim 23 , wherein the first and second conductive via portions comprises copper, the copper of the first conductive via portion having an impurity material therein.
29. The microelectronic device of claim 23 , wherein the first conductive portion has a higher percentage of alloying elements as compared to the second conductive via portion.
30. A bonded structure comprising the microelectronic device of claim 23 , wherein the microelectronic device is directly bonded to another element without an intervening adhesive.
31. The bonded structure of claim 30 , wherein the end surface of the second conductive via portion is directly bonded to a contact pad of the another element without an intervening adhesive.
32. The bonded structure of claim 30 , wherein nonconductive bonding regions of the microelectronic element and the another element are directly bonded without an intervening adhesive.
33. A bonded structure comprising the microelectronic device of claim 15 , wherein the microelectronic device is hybrid bonded to another element without an intervening adhesive,
wherein a dielectric layer on the back surface of the bulk semiconductor portion of the microelectronic device is directly bonded to a dielectric material on the element without an intervening adhesive, and
wherein the second via portion is directly bonded to a conductive feature on the element without an intervening adhesive.