Assignment of Assignor's Interest

Recorded: 2022-03-08 Pages: 3

Assignors

KURODA, TAKAHIRO

Executed: 2022-02-24

NAGOYA, TOMOHIRO

Executed: 2022-02-25

TOMORI, NAOKI

Executed: 2022-02-23

Assignee

SHOWA DENKO MATERIALS CO., LTD.

9-2, MARUNOUCHI 1-CHOME, CHIYODA-KU, TOKYO, 100-6606, JAPAN

Covered Property (1)

Temporary Protective Film, Reel Body, Packaging Body, Package Body, Temporary Protective Body, and Method for Producing Semiconductor Device

Application: 17/641,101 →

Publication: US 2022/0285200

Related Assignments (2)

Other recorded transfers of the patent in this record — the chain of ownership.