Patent Assignment
Reel/Frame 059261/0781
Assignment of Assignor's Interest
Recorded: 2022-03-15
Pages: 3
Assignors
CHEN, CHIH-HAO
Executed: 2022-03-04
CHENG, PO-YUAN
Executed: 2022-03-04
WANG, PU
Executed: 2022-03-04
CHENG, LI-HUI
Executed: 2022-03-06
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
NO.8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK,, HSINCHU, 300-78, TAIWAN
Covered Property
(1)
Package Structure with Metallic Layer Over the Surfaces of a Plurality of Semiconductor Dies