Patent Assignment
Reel/Frame 059311/0787
Assignment of Assignor's Interest
Recorded: 2022-03-18
Pages: 4
Assignors
LAI, PO-CHEN
Executed: 2022-02-07
YEW, MING-CHIH
Executed: 2022-02-07
YEH, SHU-SHEN
Executed: 2022-03-16
LIN, PO-YAO
Executed: 2022-02-07
JENG, SHIN-PUU
Executed: 2022-02-07
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK, HSINCHU, 300-78, TAIWAN
Covered Property
(1)
Semiconductor Packages with Thermal Lid and Methods of Forming the Same