Assignment of Assignor's Interest

Recorded: 2022-03-24 Pages: 9

Assignors

STRONG, VERONICA

Executed: 2021-12-16

ALEKSOV, ALEKSANDAR

Executed: 2022-01-04

DOGIAMIS, GEORGIOS

Executed: 2021-12-16

KAMGAING, TELESPHOR

Executed: 2021-12-20

GAUNKAR, NEELAM PRABHU

Executed: 2021-12-17

RAWLINGS, BRANDON

Executed: 2021-12-17

Assignee

INTEL CORPORATION

2200 MISSION COLLEGE BOULEVARD, SANTA CLARA, CALIFORNIA, 95054

Covered Property (1)

Methods, Systems, Apparatus, and Articles of Manufacture for Integrated Circuit Package Substrates with High Aspect Ratio Through Glass Vias

Application: 17/558,304 →

Publication: US 2023/0197620

Related Assignments (1)

Other recorded transfers of the patent in this record — the chain of ownership.