Patent Assignment
Reel/Frame 059391/0097
Assignment of Assignor's Interest
Recorded: 2022-03-24
Pages: 6
Assignors
JEONG, JI HOON
Executed: 2022-03-16
KIM, YOUNG-HOO
Executed: 2022-03-16
PARK, SANG JINE
Executed: 2022-03-16
PARK, JI HWAN
Executed: 2022-03-16
Assignee
SAMSUNG ELECTRONICS CO., LTD.
129, SAMSUNG-RO, YEONGTONG-GU, GYEONGGI-DO, SUWON-SI, 16677, KOREA, REPUBLIC OF
Covered Property
(1)
Apparatus and Method for Processing Substrate