Patent Assignment
Reel/Frame 059394/0246
Assignment of Assignor's Interest
Recorded: 2022-03-24
Pages: 6
Assignors
SHIN, KEUNWOOK
Executed: 2022-03-14
BYUN, KYUNG-EUN
Executed: 2022-03-21
LEE, SANGSOO
Executed: 2022-03-21
KIM, CHANGHYUN
Executed: 2022-03-21
LEE, CHANGSEOK
Executed: 2022-03-21
Assignee
SAMSUNG ELECTRONICS CO., LTD.
129, SAMSUNG-RO, YEONGTONG-GU, SUWON-SI, GYEONGGI-DO, 16677, KOREA, REPUBLIC OF
Covered Property
(1)
Thin Film Structure and Electronic Device Including Two-Dimensional Material