Patent Assignment
Reel/Frame 059420/0796
Assignment of Assignor's Interest
Recorded: 2022-03-29
Pages: 4
Assignors
HSIEH, PING-YIN
Executed: 2022-02-28
WANG, YU-HSUN
Executed: 2022-03-10
CHENG, LI-HUI
Executed: 2022-02-28
LU, SZU-WEI
Executed: 2022-03-28
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LIMITED
NO. 8, LI-HSIN 6 ROAD, HSINCHU SCIENCE PARK, HSINCHU, ROC 30077, TAIWAN
Covered Property
(1)
Package Assembly Including a Package Lid Having a Step Region and Method of Making the Same