Patent Assignment
Reel/Frame 059432/0170
Assignment of Assignor's Interest
Recorded: 2022-03-29
Pages: 6
Assignors
KIM, WOONCHUN
Executed: 2022-01-05
SHIN, SEUNGWAN
Executed: 2022-01-05
LEE, GUN
Executed: 2022-01-05
Assignee
SAMSUNG ELECTRONICS CO., LTD.
129, SAMSUNG-RO, YEONGTONG-GU, SUWON-SI, GYEONGGI-DO, 16677, KOREA, REPUBLIC OF
Covered Property
(1)
Semiconductor Package and Method of Manufacturing Same