Patent Assignment
Reel/Frame 059445/0846
Assignment of Assignor's Interest
Recorded: 2022-03-30
Pages: 8
Assignors
YU, YONG
Executed: 2022-03-17
GONG, XUERUI
Executed: 2022-03-17
ZHANG, CHANG
Executed: 2022-03-17
Assignees
CHENGDU BOE OPTOELECTRONICS TECHNOLOGY CO., LTD.
NO. 1188 HEZUO RD., (WEST ZONE), HI-TECH DEVELOPMENT ZONE, CHENGDU, SICHUAN, 611731, CHINA
BOE TECHNOLOGY GROUP CO., LTD.
NO. 10 JIUXIANQIAO RD., CHAOYANG DISTRICT, BEIJING, 100015, CHINA
Covered Property
(1)
Flip Chip and Chip Packaging Structure