Flip chip and chip packaging structure
The present disclosure relates to a flip-chip and a chip packaging structure. The flip-chip includes: a driver chip having a package surface facing a wiring substrate; and a plurality of conductive connectors. Any one of the plurality of conductive connectors includes a conductive bump connected to the package surface and a conductive extension portion on a side of the conductive bump away from the driver chip.
1. A flip-chip, comprising:
a driver chip having a package surface facing a wiring substrate;
a plurality of conductive connectors, wherein any one of the plurality of conductive connectors comprises a conductive bump connected to the package surface and a conductive extension portion on a side of the conductive bump away from the driver chip; and
a plurality of insulating bumps connected to the package surface, wherein a distance between the package surface and one end of each of the insulating bumps away from the package surface is smaller than a size of each of the conductive connectors along a direction perpendicular to the package surface;
wherein the plurality of insulating bumps comprise a first insulating bump and a second insulating bump, a distance between the first insulating bump and a side edge of the driver chip is smaller than a distance between the second insulating bump and the side edge of the driver chip; and
wherein along the direction perpendicular to the package surface, a size of the first insulating bump is larger than a size of the second insulating bump;
wherein the driver chip further comprises an electromagnetic shielding structure, the electromagnetic shielding structure comprises a shielding metal layer on the package surface, and the shielding metal layer is loaded with a ground signal of the driver signal;
wherein a melting point of the conductive extension portion is lower than a melting point of the conductive bump, and the melting point of the conductive extension portion is lower than a melting point of a metal via in the wiring substrate.
2. The flip-chip according to claim 1 , wherein along a direction perpendicular to the package surface, a size of the conductive extension portion is 10% to 15% of a size of the conductive bump.
3. The flip-chip according to claim 2 , wherein the size of the conductive extension portion along the direction perpendicular to the package surface is 1 to 3 microns.
4. The flip-chip according to claim 1 , wherein a size of each of the conductive connectors along a direction perpendicular to the package surface is 10 to 20 microns.
5. The flip-chip according to claim 1 , further comprising:
an insulating isolation layer arranged on the package surface and exposing the conductive connectors.
6. The flip-chip according to claim 5 , wherein along a direction perpendicular to the package surface, a size of the insulating isolation layer is smaller than a size of the conductive extension portion.
7. The flip-chip according to claim 1 , wherein the distance between the package surface and one end of each of the insulating bumps away from the package surface is smaller than a size of the conductive bump along a direction perpendicular to the package surface.
8. The flip-chip according to claim 1 , wherein a material of the conductive extension portion comprises gold and nickel.
9. A chip packaging structure, comprising a wiring substrate and a flip-chip;
wherein the flip-chip comprises:
a driver chip having a package surface facing a wiring substrate; and
a plurality of conductive connectors, wherein any one of the plurality of conductive connectors comprises a conductive bump connected to the package surface and a conductive extension portion on a side of the conductive bump away from the driver chip;
wherein:
the wiring substrate has a chip packaging area, and the wiring substrate is provided with a metal via and a plurality of package pads in the chip packaging area; and
the conductive connectors of the flip-chip are connected to the package pads in a one-to-one correspondence;
wherein the flip-chip further comprises:
a plurality of insulating bumps connected to the package surface, wherein a distance between the package surface and one end of each of the insulating bumps away from the package surface is smaller than a size of each of the conductive connectors along a direction perpendicular to the package surface;
wherein the plurality of insulating bumps comprise a first insulating bump and a second insulating bump, a distance between the first insulating bump and a side edge of the driver chip is smaller than a distance between the second insulating bump and the side edge of the driver chip; and
wherein along the direction perpendicular to the package surface, a size of the first insulating bump is larger than a size of the second insulating bump;
wherein the driver chip further comprises an electromagnetic shielding structure, the electromagnetic shielding structure comprises a shielding metal layer on the package surface, and the shielding metal layer is loaded with a ground signal of the driver signal;
wherein a melting point of the conductive extension portion is lower than a melting point of the conductive bump, and the melting point of the conductive extension portion is lower than a melting point of the metal via in the wiring substrate.
10. The chip packaging structure according to claim 9 , wherein the wiring substrate comprises:
a flexible substrate having a first surface and a second surface opposite to each other, wherein the metal via connects the first surface and the second surface;
a first metal layer arranged on the first surface and comprising a plurality of package pads in the chip packaging area, a first lead, and a second lead, wherein the first lead is connected to the package pads, and the second lead is connected to the package pads and the metal via; and
a second metal layer arranged on the second surface and comprising a third lead, wherein the third lead is connected to the metal via.
11. The chip packaging structure according to claim 9 , wherein a material of the metal via comprises silver and copper.
12. The chip packaging structure according to claim 9 , wherein when the flip-chip is provided with an insulating bump, an orthographic projection of the insulating bump on the wiring substrate and an orthographic projection of the metal via on the wiring substrate do not overlap.
13. The chip packaging structure according to claim 9 , wherein the wiring substrate is further provided with:
conductive leads;
a first bonding pad for electrical connection with a bonding area of the display panel, wherein the first bonding pad is electrically connected to a part of the package pads through the conductive leads; and
a second bonding pad for electrical connection with a circuit board, wherein the second bonding pad is electrically connected to a part of the package pads through the conductive leads.
14. The chip packaging structure according to claim 9 , wherein along a direction perpendicular to the package surface, a size of the conductive extension portion is 10% to 15% of a size of the conductive bump.
15. The chip packaging structure according to claim 14 , wherein the size of the conductive extension portion along the direction perpendicular to the package surface is 1 to 3 microns.
16. The chip packaging structure according to claim 9 , wherein a size of each of the conductive connectors along a direction perpendicular to the package surface is 10 to 20 microns.