Patent Assignment
Reel/Frame 059502/0470
Assignment of Assignor's Interest
Recorded: 2022-04-05
Pages: 6
Assignors
LEE, SEOKHYUN
Executed: 2021-10-20
KIM, DONGKYU
Executed: 2021-10-20
SUK, KYOUNGLIM
Executed: 2021-10-20
HWANG, HYEONJEONG
Executed: 2021-10-20
Assignee
SAMSUNG ELECTRONICS CO., LTD.
129, SAMSUNG-RO, YEONGTONG-GU, SUWON-SI, GYEONGGI-DO, 16677, KOREA, REPUBLIC OF
Covered Property
(1)
Semiconductor Package Including Redistribution Substrate and Method of Manufacturing the Same