Patent Assignment
Reel/Frame 059536/0874
Assignment of Assignor's Interest
Recorded: 2022-04-07
Pages: 2
Assignor
LI, CHUN-LIN
Executed: 2022-03-14
Assignee
WINBOND ELECTRONICS CORP.
NO. 8 KEYA 1ST RD., DAYA DISTRICT, CENTRAL TAIWAN SCIENCE PARK,, TAICHUNG CITY,, TAIWAN
Covered Property
(1)
Semiconductor Device and Method of Forming the Same