Assignment of Assignor's Interest

Recorded: 2022-04-11 Pages: 3

Assignors

ARAI, TATSUHIKO

Executed: 2022-03-03

ONO, KEISHI

Executed: 2022-03-03

NARITA, MAO

Executed: 2022-03-10

FUKAYA, TAKAHIRO

Executed: 2022-03-10

Assignee

SHOWA DENKO MATERIALS CO., LTD.

9-2, MARUNOUCHI 1-CHOME, CHIYODA-KU, TOKYO, 100-6606, JAPAN

Covered Property (1)

Photosensitive Resin Film, Resist Pattern Forming Method, and Wiring Pattern Forming Method

Application: 17/767,655 →

Publication: US 2024/0111211

Related Assignments (2)

Other recorded transfers of the patent in this record — the chain of ownership.