Patent Assignment
Reel/Frame 059575/0780
Assignment of Assignor's Interest
Recorded: 2022-04-12
Pages: 5
Assignors
CHANG, CHIEN
Executed: 2022-03-09
HUNG, MIN-HSIU
Executed: 2022-03-13
LIAO, YU-HSIANG
Executed: 2022-03-22
WANG, YU-SHIUAN
Executed: 2022-03-20
CHANG, TAI MIN
Executed: 2022-03-20
LIN, KAN-JU
Executed: 2022-03-09
CHOU, CHIH-SHIUN
Executed: 2022-03-09
HUANG, HUNG-YI
Executed: 2022-03-09
CHANG, CHIH-WEI
Executed: 2022-03-09
TSAI, MING-HSING
Executed: 2022-04-07
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK, HSINCHU, 300-78, TAIWAN
Covered Property
(1)
Barrier Layer for an Interconnect Structure