Barrier layer for an interconnect structure
A barrier layer is formed in a portion of a thickness of sidewalls in a recess prior to formation of an interconnect structure in the recess. The barrier layer is formed in the portion of the thickness of the sidewalls by a plasma-based deposition operation, in which a precursor reacts with a silicon-rich surface to form the barrier layer. The barrier layer is formed in the portion of the thickness of the sidewalls in that the precursor consumes a portion of the silicon-rich surface of the sidewalls as a result of the plasma treatment. This enables the barrier layer to be formed in a manner in which the cross-sectional width reduction in the recess from the barrier layer is minimized while enabling the barrier layer to be used to promote adhesion in the recess.
1 . A method, comprising:
forming an opening over a metal contact and through one or more dielectric layers of a semiconductor device;
forming, in a deposition chamber in a range of approximately 350 degrees Celsius to approximately 500 degrees Celsius, a barrier layer in a plurality of sidewalls along a portion of the opening,
wherein a ratio of a width of the opening after formation of the barrier layer, and a width of the opening prior to formation of the barrier layer, is in a range of approximately 1:0.83 to approximately 1:0.973, and
wherein a titanium layer resides at a bottom of the opening and on the metal contact, wherein the plurality of sidewalls are free from the titanium layer,
wherein a width of a bottom surface of the titanium layer is less than the width of a top surface of the metal contact; and
forming a ruthenium-containing (Ru) interconnect structure over the barrier layer and on the titanium layer.
2 . The method of claim 1 ,
wherein the portion of the opening comprises a first portion of the opening included in a silicon oxide (SiOx) layer of the one or more dielectric layers; and
wherein the method further comprises:
forming another barrier layer in the plurality of sidewalls along a second portion of the opening adjacent to the first portion,
wherein the other barrier layer includes a compound containing titanium, silicon, and nitride, and
wherein the second portion of the opening is included in a silicon nitride (SixNy) layer, of the one or more dielectric layers, under the silicon oxide layer.
3 . The method of claim 2 ,
wherein forming the other barrier layer comprises:
providing a flow of titanium chloride (TiClx) and a hydrogen gas into the opening,
wherein titanium of the titanium chloride and silicon nitride of the silicon nitride layer react to form titanium silicon nitride of the other barrier layer in the plurality of sidewalls along the second portion of the opening in the silicon nitride layer, and
wherein chlorine of the titanium chloride and the hydrogen gas react to form a hydrochloric acid byproduct.
4 . The method of claim 1 ,
wherein forming the barrier layer comprises:
providing a flow of titanium chloride (TiClx) and a hydrogen gas into the opening,
wherein titanium of the titanium chloride and silicon oxide (SiOx) of a silicon oxide layer of the one or more dielectric layers react to form titanium silicon oxide of the barrier layer in the plurality of sidewalls along the portion of the opening in the silicon oxide layer, and
wherein chlorine of the titanium chloride and the hydrogen gas react to form a hydrochloric acid byproduct.
5 . The method of claim 4 ,
wherein a ratio between the titanium chloride to the hydrogen gas is in a range of greater than 1:1 to approximately 1:1.25.
6 . The method of claim 1 ,
wherein the barrier layer and the Ru interconnect structure resides above a top surface of the metal contact.
7 . The method of claim 1 , further comprising:
removing the Ru interconnect structure and the titanium layer; and
forming, after removing the Ru interconnect structure, a second Ru interconnect structure over the barrier layer, into the opening, and onto the metal contact.
8 . The method of claim 7 , wherein removing the Ru interconnect structure and the titanium layer comprises:
removing the Ru interconnect structure; and
removing, after removing the Ru interconnect structure, the titanium layer.
9 . A method, comprising:
forming an opening over a metal contact and through one or more dielectric layers of a semiconductor device;
forming, in a deposition chamber in a range of approximately 350 degrees Celsius to approximately 500 degrees Celsius, a barrier layer in a plurality of sidewalls along a portion of the opening,
wherein a titanium layer resides on the metal contact, wherein a bottom surface of the titanium layer resides above a top most surface of the metal contact,
wherein a width of a bottom surface of the titanium layer is less than the width of a top surface of the metal contact;
removing the titanium layer from the metal contact after forming the barrier layer; and
forming a ruthenium-containing (Ru) interconnect structure over the barrier layer and on the metal contact after removing the titanium layer.
10 . The method of claim 9 ,
wherein removing the titanium layer comprises:
performing a plasma etch operation using an argon (Ar) plasma to remove the titanium layer from the metal contact.
11 . The method of claim 9 ,
wherein forming the barrier layer comprises:
providing a flow of titanium chloride (TiClx) and a hydrogen gas into the opening for a time duration in a range of approximately 10 seconds to approximately 80 seconds.
12 . The method of claim 9 ,
wherein forming the barrier layer comprises:
performing a plasma enhanced chemical vapor deposition (PECVD) operation to form the barrier layer,
wherein a plasma in the PECVD operation bombards the one or more dielectric layers, which results in formation of mobilized silicon atoms in the one or more dielectric layers, and
wherein the mobilized silicon atoms diffuse toward a surface of the one or more dielectric layers where the mobilized silicon atoms and a titanium precursor react to form the barrier layer.
13 . The method of claim 9 ,
wherein forming the ruthenium interconnect structure comprises:
performing a conformal deposition operation to deposit ruthenium over the barrier layer and on the metal contact.
14 . The method of claim 9 , wherein the Ru interconnect structure is a first Ru interconnect structure, and the method further comprising:
forming, after forming the barrier layer, a second Ru interconnect structure over the barrier layer and the titanium layer; and
removing the second Ru interconnect structure,
wherein removing the titanium layer is after removing the second Ru interconnect structure, and
wherein forming the first Ru interconnect structure is after removing the titanium layer.
15 . A method, comprising:
forming an opening, in at least a dielectric layer, over a metal source/drain contact, wherein the opening has angled sidewalls;
forming, using a plasma-based deposition operation in a deposition chamber in a range of approximately 350 degrees Celsius to approximately 500 degrees Celsius, a barrier layer in the angled sidewalls,
wherein a ratio of a width of the opening after formation of the barrier layer, and a width of the opening prior to formation of the barrier layer, is in a range of approximately 1:0.83 to approximately 1:0.973, and
wherein a metal layer resides on the metal source/drain contact, wherein the angled sidewalls are free from the metal layer; and
forming, after forming the barrier layer, an interconnect structure in the opening and on the barrier layer.
16 . The method of claim 15 ,
wherein forming the barrier layer comprises:
providing a precursor onto the angled sidewalls over the metal source/drain contact, wherein the precursor consumes a portion of a surface of the angled sidewalls.
17 . The method of claim 16 ,
wherein the precursor comprises titanium and gas.
18 . The method of claim 15 , further comprising:
forming the metal layer over the metal source/drain contact,
wherein the interconnect structure is formed on the metal layer.
19 . The method of claim 15 ,
wherein a bottom width of the interconnect structure is less than at least one of: a top width of the interconnect structure or a top width of the metal source/drain contact.
20 . The method of claim 15 , wherein the interconnect structure is a first interconnect structure, and the method further comprising:
forming, after forming the barrier layer, a second interconnect structure over the barrier layer and the metal layer;
removing the second interconnect structure; and
removing, after removing the second interconnect structure, the metal layer,
wherein forming the first interconnect structure is after removing the metal layer.