Patent Assignment
Reel/Frame 059601/0668
Assignment of Assignor's Interest
Recorded: 2022-04-14
Pages: 6
Assignors
HONG, BYOUNGHAK
Executed: 2022-03-31
SEO, KANG-ILL
Executed: 2022-04-07
MARTINEAU, JASON
Executed: 2022-03-31
Assignee
SAMSUNG ELECTRONICS CO., LTD.
129, SAMSUNG-RO, YEONGTONG-GU, GYEONGGI-DO, SUWON-SI, 16677, KOREA, REPUBLIC OF
Covered Property
(1)
3D Stacked Chip That Shares Power Rails