Patent Assignment
Reel/Frame 059650/0756
Assignment of Assignor's Interest
Recorded: 2022-04-20
Pages: 6
Assignors
NEGISHI, MOTOHIRO
Executed: 2022-04-11
NAKAKO, HIDEO
Executed: 2022-04-11
NATORI, MICHIKO
Executed: 2022-04-12
ISHIKAWA, DAI
Executed: 2022-04-12
SUGAMA, CHIE
Executed: 2022-04-12
KAWANA, YUKI
Executed: 2022-04-11
Assignee
SHOWA DENKO MATERIALS CO., LTD.
9-2, MARUNOUCHI 1-CHOME, CHIYODA-KU, TOKYO, 100-6606, JAPAN
Covered Property
(1)
Copper Paste for Joining, Method for Manufacturing Joined Body, and Joined Body
Related Assignments
(2)
Other recorded transfers of the patent in this record — the chain of ownership.