Patent Assignment
Reel/Frame 059653/0843
Assignment of Assignor's Interest
Recorded: 2022-04-20
Pages: 5
Assignors
BAEK, SEUNG DAE
Executed: 2022-04-05
HEO, KUEM DONG
Executed: 2022-04-05
LEE, KANG WON
Executed: 2022-04-05
KONG, WOON
Executed: 2022-04-05
Assignee
ZEUS CO., LTD.
132, ANNYEONGNAM-RO, HWASEONG-SI,, GYEONGGI-DO, 18363, KOREA, REPUBLIC OF
Covered Property
(1)
Wafer Processing Apparatus and Wafer Processing Method