Assignment of Assignor's Interest

Recorded: 2022-04-21 Pages: 6

Assignors

SOBUE, SHOGO

Executed: 2022-04-11

IRIZAWA, SHINJI

Executed: 2022-04-16

TANAKA, MIKA

Executed: 2022-04-11

OGAWA, SAEKO

Executed: 2022-04-11

Assignee

SHOWA DENKO MATERIALS CO., LTD.

9-2, MARUNOUCHI 1-CHOME, CHIYODA-KU, TOKYO, 100-6606, JAPAN

Covered Property (1)

Resin Composition for Temporary Fixation, Substrate-Conveying Support Tape, and Electronic Equipment Device Manufacturing Method

Application: 17/770,627 →

Publication: US 2022/0289920

Related Assignments (2)

Other recorded transfers of the patent in this record — the chain of ownership.