IP Library Assignment 059666/0118
Patent Assignment
Reel/Frame 059666/0118

Assignment of Assignor's Interest

Recorded: 2022-04-21 Pages: 3
Assignors
UZOH, CYPRIAN EMEKA
Executed: 2015-08-31
KATKAR, RAJESH
Executed: 2015-08-28
Assignee
INVENSAS CORPORATION
3025 ORCHARD PARKWAY, SAN JOSE, CALIFORNIA, 95134
Covered Property (1)
Multiple Plated via Arrays of Different Wire Heights on a Same Substrate
Patent: 49,987 →
Application: 17/725,442 →
Related Assignments (3)
Other recorded transfers of the patent in this record — the chain of ownership.
Change of Name Apr 21, 2022
From: INVENSAS CORPORATION
To: INVENSAS LLC
Reel/Frame 059746/0890 →
Security Interest May 3, 2023
From: ADEIA GUIDES INC.; ADEIA IMAGING LLC; ADEIA MEDIA HOLDINGS LLC; ADEIA MEDIA SOLUTIONS INC.
To: BANK OF AMERICA, N.A., AS COLLATERAL AGENT
Reel/Frame 063529/0272 →
Change of Name Oct 2, 2024
From: INVENSAS LLC
To: ADEIA SEMICONDUCTOR TECHNOLOGIES LLC
Reel/Frame 069087/0330 →