Patent Assignment
Reel/Frame 059667/0622
Assignment of Assignor's Interest
Recorded: 2022-04-21
Pages: 3
Assignors
CHANG, JEN-YUAN
Executed: 2022-04-14
THEI, KONG-BENG
Executed: 2022-04-14
KAO, JUNG-HUI
Executed: 2022-04-14
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK, HSINCHU, 300-78, TAIWAN
Covered Property
(1)
Method of Forming Testing Module and Method for Using the Same