Patent Assignment
Reel/Frame 059671/0461
Assignment of Assignor's Interest
Recorded: 2022-04-21
Pages: 5
Assignors
LIN, PO-SHAO
Executed: 2022-01-27
LIU, YI-HSIU
Executed: 2022-04-14
CHANG, CHIH-CHUNG
Executed: 2022-01-24
KO, CHUNG-TING
Executed: 2022-01-24
LIN, SUNG-EN
Executed: 2022-01-24
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK, HSINCHU, 300-78, TAIWAN
Covered Property
(1)
Semiconductor Device Structure and Method for Forming the Same