Patent Assignment
Reel/Frame 059694/0106
Assignment of Assignor's Interest
Recorded: 2022-04-25
Pages: 2
Assignors
MAO, KUAN-HSIANG
Executed: 2022-04-05
MOHD SUKEMI, NORAZHAM
Executed: 2022-04-06
SIONG, CHIN TECK
Executed: 2022-04-06
LO, TSUNG NAN
Executed: 2022-04-06
HUANG, WEN HUNG
Executed: 2022-04-06
Assignee
NXP B.V.
HIGH TECH CAMPUS 60, EINDHOVEN, 5656 AG, NETHERLANDS
Covered Property
(1)
Semiconductor Packages with Embedded Wiring on Re-Distributed Bumps