Patent Assignment
Reel/Frame 059696/0880
Assignment of Assignor's Interest
Recorded: 2022-04-25
Pages: 9
Assignors
SEDDON, MICHAEL J.
Executed: 2020-07-10
CARNEY, FRANCIS J.
Executed: 2020-08-03
CHEW, CHEE HIONG
Executed: 2020-07-10
WANG, SOON WEI
Executed: 2020-07-10
KUROSE, EIJI
Executed: 2020-07-10
Assignee
SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
5005 E. MCDOWELL ROAD, MD A700, PHOENIX, ARIZONA, 85008
Covered Property
(1)
Semiconductor Packages with Die Including Cavities
Related Assignments
(2)
Other recorded transfers of the patent in this record — the chain of ownership.
Security Interest
Aug 4, 2022
From: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC; ON SEMICONDUCTOR CONNECTIVITY SOLUTIONS, INC.
To: DEUTSCHE BANK AG NEW YORK BRANCH, AS COLLATERAL AGENT
Reel/Frame 061071/0525 →
Release of Security Interest in Patents, Recorded at Reel 061071, Frame 052
Jun 22, 2023
From: DEUTSCHE BANK AG NEW YORK BRANCH, AS COLLATERAL AGENT
To: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC, AS GRANTOR; ON SEMICONDUCTOR CONNECTIVITY SOLUTIONS, INC., AS GRANTOR
Reel/Frame 064067/0654 →