Patent Assignment
Reel/Frame 059734/0979
Assignment of Assignor's Interest
Recorded: 2022-04-26
Pages: 7
Assignors
DESHPANDE, NITIN A.
Executed: 2022-04-13
KARHADE, OMKAR G.
Executed: 2022-03-16
BHATIA, MOHIT
Executed: 2022-04-25
MALLIK, DEBENDRA
Executed: 2022-04-25
Assignee
INTEL CORPORATION
2200 MISSION COLLEGE BOULEVARD, SANTA CLARA, CALIFORNIA, 95054
Covered Property
(1)
Microelectronic Structure Including Active Base Substrate with Through Vias Between a Top Die and a Bottom Die Supported on an Interposer