IP Library › Assignment 059742/0457
Patent Assignment
Reel/Frame 059742/0457

Assignment of Assignor's Interest

Recorded: 2022-04-27 Pages: 3
Assignors
LEE, JONG JOO
Executed: 2022-04-21
KIM, KYEONG MIN
Executed: 2022-04-21
Assignee
SK HYNIX INC.
2091, GYEONGCHUNG-DAERO, BUBAL-EUB, ICHEON-SI GYEONGGI-DO, 17336, KOREA, REPUBLIC OF
Covered Property (1)
Semiconductor Package Including Stacked Semiconductor Chips
Application: 17/730,715 →
Publication: US 2023/0139378