IP Library Assignment 059770/0053
Patent Assignment
Reel/Frame 059770/0053

Assignment of Assignor's Interest

Recorded: 2022-04-29 Pages: 3
Assignor
SHUEH, YA-CHE
Executed: 2021-11-04
Assignee
HUA YA APPLIED MATERIALS COMPANY LIMITED
NO. 88, ANXIN 6TH RD., ANNAN DIST., TAINAN CITY, 709, TAIWAN
Covered Property (1)
Substrate Structure and Manufacturing Method Thereof, Electronic Device
Application: 17/559,219 →
Publication: US 2022/0210916
Related Assignments (2)
Other recorded transfers of the patent in this record — the chain of ownership.
Change of Name May 17, 2023
From: HUA YA APPLIED MATERIALS COMPANY LIMITED
To: PANELSEMI CORPORATION
Reel/Frame 063670/0595 →
Corrective Assignment to Correct the Conveying Party's Name Previously Recorded at Reel: 059770 Frame: 0053. Assignor(S) Hereby Confirms the Assignment. May 17, 2023
From: HSUEH, YA-CHE
To: HUA YA APPLIED MATERIALS COMPANY LIMITED
Reel/Frame 064657/0590 →