IP Library Assignment 064657/0590
Patent Assignment
Reel/Frame 064657/0590

Corrective Assignment to Correct the Conveying Party's Name Previously Recorded at Reel: 059770 Frame: 0053. Assignor(S) Hereby Confirms the Assignment.

Recorded: 2023-05-17 Pages: 4
Assignor
HSUEH, YA-CHE
Executed: 2023-05-09
Assignee
HUA YA APPLIED MATERIALS COMPANY LIMITED
NO. 88, ANXIN 6TH RD., ANNAN DIST., TAINAN CITY, 709, TAIWAN
Covered Property (1)
Substrate Structure and Manufacturing Method Thereof, Electronic Device
Application: 17/559,219 →
Publication: US 2022/0210916
Related Assignments (2)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest Apr 29, 2022
From: SHUEH, YA-CHE
To: HUA YA APPLIED MATERIALS COMPANY LIMITED
Reel/Frame 059770/0053 →
Change of Name May 17, 2023
From: HUA YA APPLIED MATERIALS COMPANY LIMITED
To: PANELSEMI CORPORATION
Reel/Frame 063670/0595 →