IP Library Assignment 059801/0867
Patent Assignment
Reel/Frame 059801/0867

Assignment of Assignor's Interest

Recorded: 2022-05-03 Pages: 4
Assignors
GRIVNA, GORDON M.
Executed: 2017-02-27
ST. GERMAIN, STEPHEN
Executed: 2017-02-27
Assignee
SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
5005 E. MCDOWELL ROAD, MD A700, PHOENIX, ARIZONA, 85008
Covered Property (1)
Semiconductor Device and Method for Supporting Ultra-Thin Semiconductor Die
Application: 17/661,890 →
Publication: US 2022/0262633
Related Assignments (2)
Other recorded transfers of the patent in this record — the chain of ownership.
Security Interest Aug 4, 2022
From: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC; ON SEMICONDUCTOR CONNECTIVITY SOLUTIONS, INC.
To: DEUTSCHE BANK AG NEW YORK BRANCH, AS COLLATERAL AGENT
Reel/Frame 061071/0525 →
Release of Security Interest in Patents, Recorded at Reel 061071, Frame 052 Jun 22, 2023
From: DEUTSCHE BANK AG NEW YORK BRANCH, AS COLLATERAL AGENT
To: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC, AS GRANTOR; ON SEMICONDUCTOR CONNECTIVITY SOLUTIONS, INC., AS GRANTOR
Reel/Frame 064067/0654 →