Patent Assignment
Reel/Frame 059837/0264
Assignment of Assignor's Interest
Recorded: 2022-05-06
Pages: 6
Assignors
LEE, JEONIL
Executed: 2022-04-26
LEE, JONGMIN
Executed: 2022-04-26
CHOI, JIMIN
Executed: 2022-04-26
LEE, YEONJIN
Executed: 2022-04-26
Assignee
SAMSUNG ELECTRONICS CO., LTD.
129, SAMSUNG-RO, YEONGTONG-GU, SUWON-SI, GYEONGGI-DO, 16677, KOREA, REPUBLIC OF
Covered Property
(1)
Semiconductor Device Including Through-Silicon via and Method of Forming the Same