Patent Assignment
Reel/Frame 059837/0608
Assignment of Assignor's Interest
Recorded: 2022-05-06
Pages: 3
Assignors
YANG, CHIH-HSIN
Executed: 2022-04-25
CHEN, DIAN-HAU
Executed: 2022-05-05
CHEN, YEN-MING
Executed: 2022-04-24
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
NO. 8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK, HSINCHU, 300-78, TAIWAN
Covered Property
(1)
Method for Forming Semiconductor Structure