Patent Assignment
Reel/Frame 059843/0541
Assignment of Assignor's Interest
Recorded: 2022-05-06
Pages: 4
Assignors
CHOI, MINJUNG
Executed: 2022-04-13
LEE, JONGMIN
Executed: 2022-04-13
CHOI, JIMIN
Executed: 2022-04-13
Assignee
SAMSUNG ELECTRONICS CO., LTD.
129, SAMSUNG-RO, YEONGTONG-GU, SUWON-SI, GYEONGGI-DO, 16677, KOREA, REPUBLIC OF
Covered Property
(1)
Semiconductor Device Including Multi-Capping Layer and Method for Manufacturing the Same