Patent Assignment
Reel/Frame 059869/0624
Assignment of Assignor's Interest
Recorded: 2022-05-09
Pages: 7
Assignors
KIM, GEUNWOO
Executed: 2022-04-25
SHIN, JIWON
Executed: 2022-04-25
KWON, DONGUK
Executed: 2022-04-19
MYUNG, WOORAM
Executed: 2022-04-25
WOO, KWANGBOK
Executed: 2022-04-19
Assignee
SAMSUNG ELECTRONICS CO., LTD.
129, SAMSUNG-RO, YEONGTONG-GU, GYEONGGI-DO, SUWON-SI, 16677, KOREA, REPUBLIC OF
Covered Property
(1)
Semiconductor Package and Method of Manufacturing the Semiconductor Package