Patent Assignment
Reel/Frame 059874/0190
Assignment of Assignor's Interest
Recorded: 2022-05-09
Pages: 4
Assignors
LIN, EN-PING
Executed: 2021-07-16
KO, YU-LING
Executed: 2021-08-25
WANG, I-CHUNG
Executed: 2021-07-18
CHEN, YI-JEN
Executed: 2021-08-15
JOU, SHENG-KAI
Executed: 2021-06-22
LIAO, CHIH-TENG
Executed: 2021-06-22
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
NO.8, LI-HSIN RD. 6, SCIENCE BASED INDUSTRIAL PARK, HSINCHU, 300, TAIWAN
Covered Property
(1)
Method of Manufacturing a Semiconductor Device